The NAND flash business is transitioning from the process that has been used for the past 20-odd years (let's call it "2D") and the new process that promises to carry the technology through the end of ...

It’s the tale of two promising and separate 3D chip architectures. One technology is slowly taking root, while the other one is heating up. 3D stacked-die using through-silicon vias (TSVs) is on the ...

Silicon has been with us for many decades but will need a replacement. For NAND storage, it has become increasingly difficult to progress by shrinking the process. The chief way to combat this is to ...

Silicon nitride (Si3N4) etching is a critical process step in the fabrication of three-dimensional NAND flash memories, where vertically stacked layers demand exceptional process precision. The ...

There is a growing demand for higher-density NAND flash across the global storage market. For the time being, this demand has been satisfied through many developments, not only in the capabilities of ...

Without a doubt, 3D NAND is the future. 2D planar NAND is already at its limitations and everyone in the memory industry is already making the switch to 3D for their next generation products. While ...

Samsung has begun mass producing 3D vertical NAND (V-NAND) flash memory after 10 years of research and development. In a blog post Tuesday, the South Korean firm said that the V-NAND will be used ...

Coventor’s powerful SEMulator3D semiconductor process modeling platform offers a wide range of technology development capabilities for the development of cutting edge 3D NAND Flash Technology. 3D NAND ...