Development boards are a staple of the Maker movement, and this year’s Washington DC Maker Faire showcase did not fail to impress. Promising an IoT-ready platform that lets users build computer vision ...
The VD55H1 indirect Time-of-Flight (iToF) sensor from STMicroelectronics brings 3D depth imaging to smartphones and other devices. With its 672×804 back-side illuminated (BSI) pixel array, the sensor ...
Citing a source with knowledge about Apple’s new iPhones, Fast Company writes that Apple will introduce a rear-facing 3D sensor array to new iPhone models. Apple plans to buy the laser components for ...
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