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In semiconductor manufacturing, the chemical mechanical polishing (or CMP) step is used to planarize, or create a level topography, between each layer of the interconnect structure as the device is ...
HSINCHU, Taiwan — September 10, 2008 — Rohm and Haas Electronic Materials (NYSE:ROH), CMP Technologies, a leader and innovator in chemical mechanical planarization (CMP) technology for the global ...
SAN JOSE, Calif. — Rohm and Haas Electronic Materials (R&H) has expanded its efforts in the chemical mechanical planarization (CMP) pad arena. R&H announced two additions to its IC1000 pad line, ...
In semiconductor manufacturing, a process called chemical mechanical planarization (CMP) is used for polishing wafer surfaces. CMP uses a slurry that contains both functional chemicals and ...
DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/n63tp6/cmp_consumables) has announced the addition of the "CMP Consumables ...
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