HSINCHU, Taiwan — September 10, 2008 — Rohm and Haas Electronic Materials (NYSE:ROH), CMP Technologies, a leader and innovator in chemical mechanical planarization (CMP) technology for the global ...
In semiconductor manufacturing, the chemical mechanical polishing (or CMP) step is used to planarize, or create a level topography, between each layer of the interconnect structure as the device is ...
Effective fabrication of complex, high performance semiconductor devices is highly dependent on the use of chemical mechanical planarization (CMP). This process is used to planarize the wafer surface ...
The Effect Of Pattern Loading On BEOL Yield And Reliability During Chemical Mechanical Planarization
Chemical mechanical planarization (CMP) is required during semiconductor processing of many memory and logic devices. CMP is used to create planar surfaces and achieve uniform layer thickness during ...
Researchers can now detect the formation of keyhole pores, one of the most challenging defects common in additive manufacturing, with incredible accuracy. A research team led by Tao Sun, associate ...
A research team led by Tao Sun, associate professor of materials science and engineering at the University of Virginia, has made new discoveries that can expand additive manufacturing in aerospace and ...
Results that may be inaccessible to you are currently showing.
Hide inaccessible results
Feedback