To allow real-time control of dielectric chemical mechanical planarization (CMP) processes to the 45 nm device node and beyond, Santa Clara, Calif.-based semiconductor manufacturing equipment leader ...

For decades, semiconductor manufacturers have used chemical-mechanical polishing (CMP) as the primary technique for the smoothing and leveling (planarization) of dielectrics and metal layers. CMP ...

Effective fabrication of complex, high performance semiconductor devices is highly dependent on the use of chemical mechanical planarization (CMP). This process is used to planarize the wafer surface ...

Chipmakers are relying on machine learning for electroplating and wafer cleaning at leading-edge process nodes, augmenting traditional fault detection/classification and statistical process control in ...

Electronic and computer processors with a higher speed need smaller features for integrated circuits (IC), which also need smoother and smaller substrate surfaces. Chemical mechanical polishing (CMP) ...

Suppliers of chemical mechanical planarization (CMP) slurries may be fierce competitors of Cabot Microelectronics, the company considered to be the sector's number one player, but they agree with the ...

Novellus Systems Inc. says it has taken what was good about SpeedFam-IPEC's technology and fixed what wasn't with Xceda. The Silicon Valley-based back-end-of-line process tool vendor today unveiled ...