Sacmi Imola S.C.'s Closures and Containers Division will demonstrate its compression blow forming (CBF) technology at NPE2018 in Booth W363. CBF combines elements of compression molding and blow ...
System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...
Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...
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