The growing demand for heterogeneous integration is driven by the 5G market. This includes smartphones, data centers, servers, high-performance computing (HPC), artificial intelligence (AI) and ...
One of the contributors to layer-to-layer overlay in today’s chip manufacturing process is wafer distortion due to thin film deposition. Mismatch in the film specific material parameters (e.g., ...
There is no variation in the metallurgical microstructure of the steel at galvanizing temperatures, and the galvanizing process is not sufficiently hot to cause any heat-treating effects on the ...
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