What is the Market Size of Embedded Substrates (ETS)? The Global Embedded Substrate (ETS) Market was valued at USD 1242 Million in the year 2024 and is projected to reach a revised size of USD 2182 ...
Continued pressure for electronic devices that provide greater functionality in ever-smaller form-factors is not only providing the driving force behind developing smaller surface-mount components and ...
RF front ends are advancing through the integration of high-frequency passive networks with increasingly efficient active devices engineered for ultra-wide bandwidths and constrained power envelopes.
The complexity and density of electronics design has increased, partly due to the rise of the mobile industry, introducing new challenges for printed-circuit board (PCB) designers. Embedding ...
Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...
TOKYO — Matsushita Electric Industrial Co. Ltd. has developed a three-dimensional, multilayered module technology that connects systems-on-chip with passive components by embedding them in substrate ...
New York, Aug. 18, 2022 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Global Integrated Passive Devices Market Size, Share & Industry Trends Analysis Report By Application, ...
Murata Electronics North America has introduced the GRU series, the world's thinnest embedded monolithic capacitor for substrates. Using advanced ceramic technology, the new 0402 size capacitor, ...
A multi-domain passive module with functionality embedded in the substrate has been developed by Saras Micro Devices. The Saras Tile, or STILE, enables power regulation from system board to package.
BENGALURU, India, Oct. 21, 2025 /PRNewswire/ -- Embedded Substrate (ETS) Market is Segmented by Type (Embedded Passive Substrate(EPS), Embedded Trace Substrate(ETS), Embedded Dies Substrate(EDS)), by ...
Embedded Passive Substrate contributes to the expansion of the Embedded Substrate Market by integrating resistors, capacitors, and inductors directly into the substrate layers, enabling ...