The complexity and density of electronics design has increased, partly due to the rise of the mobile industry, introducing new challenges for printed-circuit board (PCB) designers. Embedding ...

A multi-domain passive module with functionality embedded in the substrate has been developed by Saras Micro Devices. The Saras Tile, or STILE, enables power regulation from system board to package.

Semiconductor manufacturers have developed innovative production techniques that enable the integration of multiple components and a dc-dc converter IC die into a single module. Producing such a dc-dc ...

More power in the same footprint is the constant request of the power industry’s customers. This challenge has hit a fever pitch as digital semiconductor packaging technology has increased performance ...