Lidless FCBGA packages maximize PCB real estate by allowing closer spacing between passive components and the flip chip die. Lidless FCBGA packages enable the die to contact with an external heat sink ...
Endicott, N.Y.— Endicott Interconnect Technologies has developed a semiconductor package marketed under the brand-name CoreEZ, which uses an organic, thin core build-up flip chip technology that ...
Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of ...
Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...
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