March 14 (Reuters) - TOPPAN Holdings Inc: * TOPPAN - TO BUILD NEW FLIP CHIP BALL GRID ARRAY (FC-BGA) SUBSTRATE PLANT IN SINGAPORE, AIMS TO START PRODUCTION IN END ...
Lidless FCBGA packages maximize PCB real estate by allowing closer spacing between passive components and the flip chip die. Lidless FCBGA packages enable the die to contact with an external heat sink ...
A family of 0.50 mm lead-pitch sockets is intended for production, development, test and debug where a finer pitch socket is needed. Sockets available are a ball-grid array (BGA), chip-scale package ...
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