Live Science on MSN

MIT's chip stacking breakthrough could cut energy use in power-hungry AI processes

Data doesn’t have to travel as far or waste as much energy when the memory and logic components are closer together.
Morning Overview on MSN

MIT’s chip stacking leap could slash energy use for hungry AI chips

Artificial intelligence is colliding with a hard physical limit: the energy it takes to move data on and off chips. Training ...
Semiconductor Engineering

Fully CMOS-compatible Ternary Inverter with a Memory Function Using Silicon Feedback Field-Effect Transistors (FBFETs)

New technical paper titled “New ternary inverter with memory function using silicon feedback field-effect transistors” was published from researchers at Korea University. In this study, we present a ...
Semiconductor Engineering

One Transistor Process-in-Memory Device Strategy w/ Multi-Functional Multi-Gate One-transistor (MGT) Design of Multiple Electrodes

New technical paper titled “Multi-functional multi-gate one-transistor process-in-memory electronics with foundry processing and footprint reduction” from researchers at Ningbo Institute of Materials ...

Digital Storage And Memory Projections For 2026, Part 2

AI is driving demand and higher prices for DRAM and NAND into 2026.  Products using non-volatile memories to replace NOR and SRAM in embedded applications are growing.