Santa Clara, CA and Kyoto, Japan, June 11, 2024 (GLOBE NEWSWIRE) -- ROHM Semiconductor today introduced four new models as part of the TRCDRIVE pack™ series with 2-in-1 SiC molded modules (two ...
Santa Clara, CA and Kyoto, Japan, Sept. 16, 2025 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced the development of the DOT-247, a new 2-in-1 SiC molded module (SCZ40xxDTx, SCZ40xxKTx) designed ...
KYOTO, Japan, April 24, 2025 /PRNewswire/ -- ROHM Co., Ltd. has developed new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package for power-factor-correction (PFC) circuits and LLC-resonant ...
Rohm has introduced the DOT-247, a 2-in-1 SiC molded module that combines two TO-247 devices to deliver higher power density. The dual structure accommodates larger chips, while the optimized internal ...
SANTEE, Calif.--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, will reveal its newest molded ceramic ...
Comparison between DOT-247 and Discrete Products Two topologies offered in standardized 2-in-1 modules: half-bridge and common-source, offering increased flexibility. The DOT-247’s unique dual TO-247 ...
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