A stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by one-fold, SiC power modules allow for ...
Infineon Technologies AG today announced the availability of its "Coil on Module" (CoM) package technology for official documents. The technology simplifies and improves manufacturing of electronic ...
Microchip’s LCD PIC microcontroller family of 8-bit microcontrollers now includes a 28-pin device that integrates the PIC microcontroller with an LCD module and an 80-pin device that can drive 192 ...
FPGA-Based Development Package for M-Modules® and PMC Modules: The USMTM Universal Submodule Concept
On the occasion of Embedded World 2007 in Nuremberg and Bus&Boards 2007 in the USA MEN Mikro Elektronik is going to introduce a forward-looking further development for the two most popular mezzanine ...
IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This ...
Bangalore and Dallas—Mistral Software has put together a software-based WLAN product that will help engineers designing portable wireless devices based on Texas Instruments' DM644x series DaVinci ...
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