Dublin, July 21, 2025 (GLOBE NEWSWIRE) -- The "Power Module Packaging Market: Global Industry Analysis, Trends, Market Size, and Forecasts up to 2032" report has been added to ResearchAndMarkets.com's ...
The power module market will reach $9.5 billion by 2026, with a 10.5% CAGR between 2020 and 2026, says Yole Develeloppement. The related packaging market will have a 12.5% CAGR during the same period, ...
The 3,300- and 2,300-V SiC products from Navitas employ advanced planar device structures and packaging to augment efficiency ...
The surge in AI chips fueling CoWoS packaging demand has put silicon carbide (SiC), a third-generation semiconductor, on the verge of entering this high-value arena. The shift is set to begin within ...
(MENAFN- GlobeNewsWire - Nasdaq) The global power module packaging market, valued at USD 2.35 billion in 2023, is projected to reach USD 4.93 billion by 2032, driven by electric vehicles and ...