SCHMID Delivers First Specialized InfinityLine H+ for Panel Level Packaging with Formats up to 700×700mm to Leading U.S. Technology Company

FREUDENSTADT, Germany, March 04, 2026 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD) has successfully delivered the first specialized InfinityLine H+ system designed for Panel-Level Packaging (PLP) ...
Semiconductor Engineering

A Hybrid PLP Technology Based On A 650mm x 650mm Platform

A panel-level (PL) approach to fan-out (FO) packaging has been discussed for several years to reduce the cost of chip-first FO packaging based on redistribution layer (RDL) technology. More recently, ...
Semiconductor Engineering

Next Steps For Panel-Level Packaging

Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel ...
Mena FN

Panel Level Packaging Market To Reach US$3.0 Billion By 2033 Driven By Panel Based Processing Shift

(MENAFN- EIN Presswire) EINPresswire/ -- The panel level packaging market is gaining increasing attention within the advanced semiconductor packaging ecosystem as manufacturers seek scalable, cost ...

ACM Research Receives Multiple Advanced Packaging Equipment Orders from Leading Global Customers

Expands Advanced Packaging Platform Across Wafer-Level and Panel-Level Applications in Key Global Markets-FREMONT, Calif., Feb. 26, 2026 ...
Seeking Alpha

SCHMID GROUP ships first InfinityLine P+ Panel-Level Plating System A Breakthrough in Integrated Plating Technology

FREUDENSTADT, Germany, Oct. 08, 2025 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD), a leading global provider of equipment and solutions for the electronics industry, today announced the shipment of ...