That’s where IC packaging comes in. It’s like the housing for your phone or the case for your computer – it does a lot more ...

Interconnects for advanced packaging are at a crossroads as an assortment of new package types are pushing further into the mainstream, with some vendors opting to extend the traditional bump ...

Manz AG, a global high-tech engineering company with a comprehensive technology portfolio, showcases its high-density packaging production solutions at the SEMICON Southeast Asia 2023 on May 23-25 in ...

Impact of PCB plating Finish on Elastomer Socket Technology Ila Pal – Ironwood Electronics Introduction Today’s electronic packages have high clock speeds (multi GHz range), fine pin densities (below ...

Editor’s note: It’s not enough to choose an IC for your design just by what is in the data sheet; you will need to choose the right package and pay attention to the manufacturing and assembly needs of ...