Chipmakers are relying on machine learning for electroplating and wafer cleaning at leading-edge process nodes, augmenting traditional fault detection/classification and statistical process control in ...

Effective fabrication of complex, high performance semiconductor devices is highly dependent on the use of chemical mechanical planarization (CMP). This process is used to planarize the wafer surface ...

A fundamental component of modern electronic goods is the semiconductor. More powerful, faster and smaller processors are in constant demand for many services and goods because of the advent of the ...

In semiconductor manufacturing, the chemical mechanical polishing (or CMP) step is used to planarize, or create a level topography, between each layer of the interconnect structure as the device is ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Machine learning (ML), neural networks (NNs), and deep learning have many applications in different areas of modern industry and life. Their ability to “learn” how to analyze and predict imprecise ...