Laser-based processes for metals are considered to be particularly versatile in industry. Lasers can be used, for example, to precision-weld components together or produce more complex parts using 3D ...
State-of-the-art techniques make it possible to build a spin-chain quantum simulator based on laser-trapped circular Rydberg atoms. This simulator combines the flexibility of atomic lattices and the ...
Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...
costs: Regular participants: 300 EUR; Speaker: 160 EUR; Students: 120 EUR; Exhibition / Sponsoring: 1,500 EUR / 1,000 EUR location: Fraunhofer IWS Winterbergstrasse 28, 01277 Dresden organization: ...
Novel semiconductor technologies are creating complex process flows, which are needed to support the manufacturing of advanced 3D semiconductor structures. It can be helpful to model process flows, ...
At the 66th International Motor Show IAA in Frankfurt, Fraunhofer ILT will be presenting the joint project »Fraunhofer System Research for Electromobility II« along with 16 other Fraunhofer institutes ...
One challenge faced by all control systems integrators (CSIs) is the prospect of testing their software before deployment. CSIs often work remotely, without having the actual equipment to manipulate, ...
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