IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This ...
TEL AVIV, Israel--(BUSINESS WIRE)--Variscite, a leading worldwide System on Module (SoM) designer, developer and manufacturer, will showcase live demos of its latest SoMs at Embedded World 2025, held ...
The previous articles of this series have discussed the innovation and evolution of the integrated-circuit industry and how system-in-package (SiP) devices fit into the market. In the first article, ...
When tariffs began reshaping the electronics landscape post-Liberation Day, I watched technology companies, large and small, grapple with a critical question: How much of their product architecture ...
MINNEAPOLIS, Feb. 3 /PRNewswire/ — Logic, an innovative product solutions company, announces the availability of the AM3517 System on Module (SOM) and the Zoom AM3517 eXperimenter Development Kit ...
PHOENIX--(BUSINESS WIRE)-- Avnet Electronics Marketing, an operating group of Avnet, Inc. (NYSE: AVT), today introduced the Xilinx Zynq®-7000 All Programmable (AP) SoC Mini-Module Plus, a ...
With the explosive increase in demand for artificial intelligence (AI), autonomous driving, Internet of Things (IoT), data centers, augmented reality and virtual reality (AR/VR), the market of ...
The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC ...
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