The trend in end-equipment design is to optimize the module profile for sizing. This introduces a migration from metal heat sinks to PCB copper plane-based thermal management. Today’s modules use ...
Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...
Semiconductor device manufacturing requires careful consideration of key device fabrication and operation aspects, including the fabrication process, heat dissipation from the devices to the ...
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