Power integrated modules have been widely used in motion control for their remarkable performance, easy modular installation, and high reliability. However, as the latest die technology continues to ...

A new large DIP-IPM features a compact transfer-molded package with significantly improved thermal performance compared to previous generations. In addition, it includes a temperature feedback signal ...

PHOENIX--(BUSINESS WIRE)--ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, continues to expand its portfolio for industrial motor drive applications, to further help customers ...

Mitsubishi Electric has launched a 1200V large-type Transfer-molded Dual Inline Package Intelligent Power Module (DIPIPM) Version 4 (PS22A79) with a current rating of 50A. The new power module is ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...