Modern semiconductor fabrication involves aligning silicon wafers and photolithography masks to nanometre precision. As the industry shifts from using 200 mm diameter wafers to 300 mm wafers, ...
The ASIL-C sensor is claimed to be the smallest in the industry, while the module targets driver-monitoring hardware. Among the primary challenges facing engineers developing imaging sensors for ...
Wafer-to-wafer bonding is an essential process step to enable 3D devices such as stacked DRAM, memory-on-logic and future CMOS image sensors. At the same time, minimizing the dimensions of TSVs, which ...
One of the contributors to layer-to-layer overlay in today’s chip manufacturing process is wafer distortion due to thin film deposition. Mismatch in the film specific material parameters (e.g., ...
Consumer demand for products that incorporate camera modules such as cell phones, automobiles, and even toys continues to grow rapidly. Sales of camera phones reached 295 million units worldwide in ...
MANHASSET, N.Y. — Imagine a camera so small it can be manufactured on a wafer scale. You can stop imagining, and take out your magnifying glass. Chip-packaging company Tessera Technologies Inc.
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