Nominate your scientific computing stars for the inaugural SCW75 – an annual recognition programme celebrating the individuals driving innovation at the intersection of computing and scientific ...
Abstract: As the integrated chip packaging technology progresses from 2.5-D to 3-D, new issues arise regarding the reliability of interconnects. The analysis of interconnect reliability is inherently ...
Abstract: To address the issues of voids and insufficient interface fusion commonly encountered in electroless copper plating interconnections for high-density packaging, this paper proposes a ...
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