Engineers, simulation experts and industry leaders gather at the COMSOL Conference to explore cutting-edge research, learn ...
MedTech to learn how multiphysics simulations can efficiently optimise design and R&D in medical technology. Keynote speakers ...
For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet increasingly complex, set of challenges: how do we manage power, dissipate ...
Researchers have developed a detailed three-dimensional electro-thermo-mechanical model to identify and quantify the swelling force generated by lithium-ion batteries during charging, offering a new ...
3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, ...
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AI meets physics in next-gen engineering simulations
AI-powered physics simulations are speeding up design cycles, cutting costs, and enabling more creative engineering solutions. By combining traditional multiphysics modeling with machine learning, ...
Kazakhstan is going to hire Spain-based Xcalibur Multiphysics Group to make an updated map of its mineral deposits as part of a national project for geophysical mapping of the republic’s territory. A ...
Abstract: In this paper, we introduce a novel electro-thermo-mechanical simulation framework utilizing the unified FDTD method for efficient and accurate analysis of electrical, thermal, stress, and ...
Abstract: In this paper, we present a fully-coupled electromagnetic-thermal-mechanical multiphysics simulation method for the packaging analysis of chips by overcoming the challenges resulting from ...
A piezoelectric microporous atomizer for poultry immunization robots ensures uniform droplet formation, enhancing disease ...
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