Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN ...
New Heights in Edge AI: Significantly Faster NPU and GPU Performance ...
The new high-performance modules deliver up to 180 TOPS of power-efficient computation designed for next-level AI ...
Advantech is releasing its UNO-2372V3 edge automation computer for industrial IoT applications. For example, factory, ...
HFM FPGA Module Standard arrives with solderable and connector variants, aiming to cut board redesign time and vendor lock-in ...
A new class of compact compute module integrates heterogeneous processing with industrial-grade resilience, tackling ...
Artificial intelligence (AI) solution provider Innodisk has announced the launch of its new AI on Dragonwing computing series, developed in collaboration with Qualcomm Technologies, Inc. The flagship ...
The SGET announced a paradigm shift in embedded design with the official release of the Open Harmonised FPGA Module (oHFM) ...
SolidRun Bedrock RAI300 is the first industrial PC powered by a 12-core/24-thread AMD Ryzen AI 9 HX 370 mobile processor, ...
Workload consolidation has massive benefits, but implementation concerns have held back OEMs. Pre-integrated hardware and ...
Press Trust of India on MSN
Innodisk Corporation: Innodisk Unveils the New "AI on Dragonwing" Computing Series with the First EXMP-Q911 COM-HPC Mini Module Powered by Qualcomm's SoC
The module integrates a high-efficiency AI SoC with in-house software and peripherals to serve as a powerful Edge AI platform. TAIPEI, Jan. 6, 2026 /PRNewswire/ -- Innodisk, a leading global AI ...
In the narrative of Industry 4.0, the cloud has long been the protagonist. It promised infinite storage, massive computing power, and the ability to aggregate d ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback