Why security is important to the chiplet supply chain. Synopsys' 3DIC Compiler platform, enhanced by AI optimizations, handles multi-die and advanced chiplet packaging co-design and optimization for 2 ...

A panel of industry experts takes a sneak peek at system-level design challenges in EVs and outlines viable solutions.

ROHM Semiconductor today announced it has released reference designs "REF68005", "REF68006", and "REF68004" for three-phase inverter circuits featuring EcoSiC™ brand SiC molded modules "HSDIP20", "DOT ...

AI data centers are starting to replace copper with co-packaged optics in an effort to reduce energy consumed per bit and ...

Within three years, no embedded software developer is going to be writing code. I know it sounds like another one of my controversial statements. But I recently used Claude Code to write the best ...

Release delivers unified Synopsys-Ansys workflows that bring together previously separate engineering processes to create ...

Pickering Interfaces has launched Test System Architect (TSA), a free, online tool designed to solve signal path problems.

Nominate your scientific computing stars for the inaugural SCW75 – an annual recognition programme celebrating the individuals driving innovation at the intersection of computing and scientific ...