Abstract: A new concept for encapsulation of discrete bipolar high-power devices using epoxy mold compound (EMC) is demonstrated on silicon 4.5-kV press-pack fast recovery diodes (FRDs) with wafer ...
High-Temperature Encapsulation Materials for Power Modules: Technology and Future Development Trends
Abstract: The applications of wide bandgap (WBG) semiconductors represented by silicon carbide (SiC) and gallium nitride (GaN) in power modules are currently limited by the thermal stability of ...
This is the primary documentation for the MoveIt project. We strongly encourage you to help improve MoveIt's documentation. Please consider helping improve the tutorials, port old ones from ROS 1, and ...
INQUIMAE-DQIAQF and Departamento de Química Biológica, Facultad de Ciencias Exactas y Naturales, Universidad de Buenos Aires, Ciudad Universitaria, Pab. II, C1428EHA Buenos Aires, Argentina * ...
Because of the way in which NAT devices translate network traffic, you may experience unexpected results when you put a server behind a NAT device and then use an IPsec NAT-T environment. Therefore, ...
† Weldon School of Biomedical Engineering, Purdue University, West Lafayette, Indiana 47907, United States ‡ Department of Biomedical Engineering, Indiana University−Purdue University Indianapolis, ...
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