Leaks suggest the iPhone 18 Pro Max Dynamic Island is shrinking by 35% to 13.49mm. Learn how Apple moved Face ID sensors ...

Broadcom Inc.’s 3 nm 400 G/lane optical PAM-4 digital signal processor (DSP) is now available, designed for next generation ...

Major industry announcements and new product launches continued to drive significant visitor numbers and plentiful business ...

Microsoft has revealed the first technical details about Project Helix, its next Xbox console, including a custom AMD chip ...

Trace the evolution of AI chip makers AMD and ARM alongside energy giant Constellation Energy, examining how their innovations in processor design, energy efficiency, and sustainable power supply are ...

In the 1980s, economist Robert Solow made an observation that reminded economists of today’s AI boom: “You can see the computer age everywhere but in the productivity statistics.” ...

Samsung is preparing to elevate its smartwatch lineup with the Galaxy Watch 9 and Galaxy Watch Ultra 2. According to leaks, the company may adopt a new dual-chip strategy, where each model will ...

Continuing our round-up of this year’s CES, we look at key use cases and how the generation of artificial intelligence and connected devices will evolve.

Crystal DTF announces the "America 250" collection, providing high-fidelity 9-color transfers to help small businesses ...

Microsoft committed to shipping its next-gen console to developers in 2027, and listed several of its features. They should look familiar to PC gamers.

Acer EMEA marks 50 years of innovation with a special exhibition weaving together technology, art and contemporary design in Milan.

VeriSilicon (688521.SH) today announced that Hefei Hexagon Semiconductor (Hexagon Semi), an image processing SoC provider, has adopted VeriSilicon’s proven IP portfolio in its high-performance HX77 ...