Abstract: The requirement of 3D IC packages with very fine pitch interconnections are driven by the rapid advancement of High-Performance Computing, Artificial Intelligence, Internet of Things, and ...
Abstract: This paper introduces an optimized design procedure for a DC-DC buck, boost and buck-boost configurations in single circuit with an integrated dissipative snubber, aiming to enhance ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results