As a result, remote control technologies are being widely adopted across various sectors. Among the many components used in ...

Abstract: In this paper, a capacitance compensation structure for wire-bonding interconnection in multi-chips module is investigated. The equivalent circuit model is built to analyze the ...

Abstract: Silicon carbide (SiC) power devices offer high switching speeds and power densities but are constrained by significant parasitic inductance and limited thermal dissipation capability.