The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...

SK hynix showcases its next-gen memory solutions for AI at CES 2026: with 48GB HBM4, SOCAMM, LPDDR6, and more for future AI ...

Samsung last month unveiled a SOCAMM2 LPDDR5-based memory module designed specifically for AI data center platforms.

The patched issues span core standard library components including archive/zip and net/http, as well as security-sensitive ...

Detailed in a recently published technical paper, the Chinese startup’s Engram concept offloads static knowledge (simple ...

Quectel Wireless Solutions, an end-to-end global IoT solutions provider, today announces the launch of a new-generation smart ...

A new class of compact compute module integrates heterogeneous processing with industrial-grade resilience, tackling ...

Quectel Wireless Solutions, an end-to-end global IoT solutions provider, today announces the launch of a new-generation smart robotic computing module, the SH602HA-AP. Based on the D-Robotics Sunrise ...

ASUS confirms price hikes from 5 January as AI-driven memory shortages reshape the PC market. IDC warns laptop prices could ...

Quectel has introduced its SH602HA-AP computing module aimed at powering robotic devices, for example humanoid robots, wheel-arm robots, quadruped robots, or service companion robots.

Learn how to integrate Quantum-Safe HSMs with Model Context Protocol (MCP) to secure AI infrastructure against Shor's algorithm and context injection.

Memory may not derail the AI boom, but it is increasingly likely to shape how fast it grows, who benefits first, and at what ...