Abstract: Fatigue-induced delamination of the direct-bonded copper (DBC) solder layer is a critical and latent failure mode in multichip Insulated Gate Bipolar Transistor (IGBT) power modules. To ...
Abstract: To diagnose health status of the insulated gate bipolar transistor (IGBT) power module, structure function (SF) is extensively adopted to evaluate the thermal resistance, as well as to ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results