Intra-rack chip interconnects (scale-up) and large-scale interconnects across racks (scale-out) will become central ...

Reference design to stitch more than a thousand accelerators into a single enormous server. Exclusive If you thought Nvidia or AMD's 72-GPU rack systems were enormous, silicon Ayar Labs has something ...

I/O architecture must be co-designed with compute from day one. Partitioning SoCs into heterogeneous chiplets (compute, EIC, PIC, lasers) directly affects power delivery, floor-planning, interconnect ...

Xiaomi just launched the Xiaomi 17 Ultra smartphone in India, as it had promised, after it was introduced for the global markets at the MWC 2026 last week. The launch also marked a significant ...

MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, will participate in OFC 2026, taking place March 17–19, 2026 at the Los Angeles Convention Center. MACOM will ...

SHIP™ technology has been validated on Tower Semiconductor's silicon photonics manufacturing lines, with 200mm production underway today. This foundry alignment positions the Scintil–Tower partnership ...

The change is made possible by a new design Samsung calls ALOP (All Lenses On Prism). In previous periscope designs, the prism sat in front of the lens stack, partially blocking incoming light. In the ...

OpenLight to Showcase Production Capabilities for AI, Cloud, and High Speed Networking at OFC 2026 SANTA CLARA, CA, ...

Strategic Investment of S$3-5 billion in Singapore to advance AI-ready data centre developments, supporting over 2 GW of AI-ready capacity globally, and ...

Did our AI summary help? Smartphones rarely surprise me anymore. After reviewing dozens of devices over the years, most launches follow a predictable route- a faster chip, a brighter screen, and a few ...

Xiaomi 17 and iPhone 17 bring flagship features in a compact design. Here is a detailed comparison of their design, display, camera hardware, performance specifications, battery capacity and price in ...