ROHM Semiconductor today announced it has begun online sales of new SiC molded modules: TRCDRIVE pack™, HSDIP20 and DOT-247. Amid growing concerns over tightening global power supply and the ...
Dublin, March 11, 2026 (GLOBE NEWSWIRE)-- The "The Global Power Electronics Market 2026-2036" report has been added to ResearchAndMarkets.com's offering. The Global Power Electronics Market 2026-2036 ...
Market Outlook, Supply Chain Risk & Technology Trends 2026-2036" explores the growing power module packaging materials market, driven by the rise of SiC and GaN semiconductors and electric vehicles.
On wind farms, this includes converters, inverters, pitch and yaw control electronics, and various control system modules. In manufacturing environments, the company services variable speed drives, ...
According to MarketsandMarketstm, the global Inverter Market size is projected to grow from USD 25.33 billion in 2025 and to reach USD 54.57 billion by 2030, at a Compound Annual Growth Rate (CAGR) of ...
US-based DC power optimizer technology provider Tigo Energy has unveiled a new optimizer for high-power modules at the Key Energy trade show in Rimini, Italy. “The TS4-A (725 W) optimizer is as an ...
Edify Energy has named DT Infrastructure its preferred EPC contractor for two solar and BESS projects in Queensland.
The explosive growth of electric vehicles, renewable energy integration, and large-scale energy storage systems has placed ...
Fang Peng, the RK Mellon Endowed Chair Professor in the Department of Electrical and Computer Engineering in the University ...
I appreciate the opportunity to be able to present a company update on Ideal Power to you. My name is David Somo, President and CEO of Ideal Power. As many of you know, I joined the company in ...
EPC Highlights Gen 7 GaN for AI Infrastructure and GaN Integrated Circuits for Robotics at APEC 2026
Enabling scalable power for AI computing and next-generation robotics Our new GaN integrated circuits enable more ...
A stackable point-of-load (POL) converter recently introduced by TDK can supply up to 200 A in an ultra-compact package, enabling vertical power delivery for ASICs, FPGAs, and other SoCs in data ...
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