Abstract: This paper presents a methodology to help prevent overdesign of Electrostatic Discharge (ESD) protection circuits for internal I/O in 2.5D/3D bonding technologies. We explore how the voltage ...
Abstract: The rapid advancements of heterogeneous 2.5D systems demand innovative solutions to optimize chiplet placement, ensuring a balance between thermal management, performance, and connectivity.
MCP tools defined in Unity C# can be used directly from MCP clients such as Claude Code, GitHub Copilot(VSCode) and Cursor. An MCP server implementation provided as a Unity Package that behaves as a ...