At embedded world, on the DigiKey booth, Lucy Barnard speaks with Gina Greco at Sensirion, about its roadmap for 2026.

Rugged boards and modules were everywhere at this year’s Embedded World 2026. New form factors like VITA 93 QMC were on display along with those based on standards like COM Express. More boards and ...

Get a fully functioning APS-C sensor right in your old analogue camera ...

It thrashes the next-best foldable in the DxOMark smartphone camera rankings ...

Construction is not only about metal, oil, smoke and dust anymore.  It is also about silicon and bits, used with data and AI to move atoms and Things autonomously.

QCT Dev. Kit for physical AI integrates with new TM Xplore I Humanoid Platform powered by NVIDIA Our collaboration with ...

A key innovation of the P100 COMx6 series is SolidRun's LP-CAMM2 memory integration in an industrial COM Express Type 6 module, delivering the best of all worlds: the serviceability of modular memory ...

Nordic Semiconductors introduced the nRF93M1 LTE Cat 1bis IoT modules at Mobile World Congress 2026 with up to 10 Mbps ...

Camera-first flagships, experimental hardware and new foldables dominated Mobile World Congress (MWC) this year, offering a glimpse of where the smartphone industry is heading next ...

Vivo X300 Ultra is likely to be launched in India next quarter with the entire photography kit.

Pre-configured to identify normal, high-vibration, and unstable motor conditions STMicroelectronics (NYSE:STM)GENEVA, ...

Motorola has revealed its first-ever book-style foldable phone, and they're not holding back ...