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mesh_NACA0012_inv.su2

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IEEE

Die-Level Transformation From 2D Shuttle Chips to 3D-IC With TSV for Advanced Rapid Prototyping Methodology With Meta Bonding

Abstract: 3D-IC technology, it may be more appropriate to refer to this as TSV (Through-Si Via) formation technology, has been maturing year by year and is increasingly utilized in advanced ...
GitHub

SupeRPG (Super RPG) is a 2D Unity game with elements of turn-based RPG.

The compiled game is available for Windows, MacOS and Linux platforms in release tags. Alternatively, one can download the entire repository, open it with Unity Editor (version at least 2021.3.22f1) ...
IEEE

Recovery of 2D and 3D Layout Information through an Advanced Image Stitching Algorithm using Scanning Electron Microscope Images

Abstract: Image stitching describes the process of reconstruction of a high-resolution image by combining multiple images. Using a scanning electron microscope as the image source, individual images ...