Thermaltake, a leading PC DIY brand for premium hardware solutions, introduces the TR200 Series, a compact Micro-ATX lineup designed to deliver high-end hardware compatibility, advanced cooling ...

The latest PV Reliability Workshop highlighted why investing in PV reliability and quality is more important than ever.

Introduces FE990D50 and FE990D60 series based on Qualcomm Dragonwing(TM) FWA Gen 4 Elite platforms for high-performance industrial and enterprise applications -- Delivers up to 8RX MIMO, enhanced ...

ROHM Semiconductor today announced it has released reference designs "REF68005", "REF68006", and "REF68004" for three-phase ...

Telit Cinterion, an end-to-end IoT solutions enabler, announced the launch of its FE990D50 and FE990D60 series. The next-generation 5G New Radio (NR) sub-6 LGA modules are engineered for ...

The BZPACK mSiC power modules leverage Microchip’s advanced mSiC technology, incorporating performance of its MB and MC SiC MOSFET familiesCHANDLER, Ariz., March 19, 2026 (GLOBE NEWSWIRE) -- Microchip ...

SHENZHEN, GUANGDONG, CHINA, March 19, 2026 /EINPresswire.com/ -- The air inside the exhibition halls of the Optical ...

The unit measures 2 × 4 × 0.75 inches and delivers a power density of 33 W/in³, enabling significant miniaturization compared ...

OFC 2026: new launches round-up, part II. 19 Mar 2026. Another selection of significant announcements from the optical ...

Rugged boards and modules were everywhere at this year’s Embedded World 2026. New form factors like VITA 93 QMC were on display along with those based on standards like COM Express. More boards and ...

Handling air-sensitive materials such as lithium-ion battery compounds or reactive metals presents a significant challenge ...

The COM-HPC® Revision 1.3 specification from PICMG updates the Computer-on-Module standard with support for PCI Express Gen 6 ...