UD professor's decades-long research helps organizations design transparent, accountable AI systems as new global regulations ...

At embedded world 2026, Editor Mick Elliott spoke to Jörg Köpp, Head of Wireless Market Segment at Rohde & Schwarz ...

In this Q&A, you will learn about some of the technologies and techniques that are making it possible to address advanced packaging challenges.

Viktoria Zimmer of Würth Elektronik eiSos explains why AI fluency, power electronics expertise, and continuous learning will ...

Explore the Myron and Berna Garron Health Sciences Complex, showcasing innovative solar facade technology and sustainable ...

New design, verification and simulation solutions to re-engineer AI-powered product innovation at Synopsys Converge 2026.

Plastic is one of the most durable materials humans have ever made. That durability has made it indispensable in medicine, ...

The annual show for the embedded electronics supply chain showcased many innovations in edge AI and connected, intelligent ...

Mobile World Congress 2026 in Barcelona brought together semiconductor vendors, wireless infrastructure companies, and test-and-measurement suppliers to present new hardware platforms, chipsets, and ...

Successful modernisation depends less on the act of upgrading itself and more on the preparation that precedes it, says Ascent Technology.

Why does anything have to change? A manufacturing company’s most critical product decisions are made every day in design reviews. And if you assess the state of what a design review looks like today, ...

In collaboration with NXP, Gateworks is releasing a new M.2 AI Acceleration Card, the GW16168, with NXP's passively cooled Discrete NPU (DNPU), the Ara240. Designed, tested and assembled in ...