Abstract: Through-silicon via (TSV) has attracted much attention due to its numerous advantages, including high-density interconnection, low power consumption, and wide bandwidth. When signals are ...
Abstract: A new methodology for the synthesis of wide-angle scanning arrays is proposed. It is based on the formulation of the array design problem as a multi-objective one where, for each scan angle, ...
On December 20, 2025, in Brebes, Central Java, Indonesia, @salmaelva shared a video of severe flooding impacting a residential area. In the video, fast-moving floodwaters with a dark, muddy appearance ...
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