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MIT’s chip stacking leap could slash energy use for hungry AI chips

Artificial intelligence is colliding with a hard physical limit: the energy it takes to move data on and off chips. Training ...
IEEE

Structural and Device Considerations for Vertical Cross Point Memory with Single-stack Memory toward CXL Memory beyond 1x nm 3DXP

Abstract: In this paper, we propose the structure of the 3D vertical cross point memory (3DVXP) having byte-addressability and discuss the possible challenges and requirements from the structural ...