Packaging World

Kotex Moves to Cartons, Adds Dual-opening Design, in Portfolio-wide Pack Overhaul

Kimberly-Clark’s Kotex transitions from plastic film polybags to recyclable cartons, introducing dual-panel opening, ...
Electronic Design

Seeing the Unseen in 3D-Stacked Semiconductors

In this Q&A, you will learn about some of the technologies and techniques that are making it possible to address advanced packaging challenges.
Magazine

SCHMID Delivers First Specialized InfinityLine H+ for Panel Level Packaging with Formats up to 700×700mm to Leading U.S. Technology Company

Freudenstadt, Germany, March 04, 2026 – SCHMID Group (NASDAQ: SHMD) has successfully delivered the first specialized InfinityLine H+ system designed for Panel-Level Packaging (PLP) applications with ...
Investing.com Australia

SCHMID Group stock surges 23% on first null Line H+ delivery

Investing.com -- SCHMID Group (NASDAQ:SHMD) shares jumped 23% Wednesday after the company delivered its first specialized null Line H+ system for Panel-Level Packaging applications to a leading U.S.
The Bakersfield Californian

SCHMID Delivers First Specialized InfinityLine H+ for Panel Level Packaging with Formats up to ...

FREUDENSTADT, Germany, March 04, 2026 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD) has successfully delivered the first specialized InfinityLine H+ system designed for Panel-Level Packaging (PLP) ...
IEEE

Studying Asymmetric Warpage Behavior of Panel-Level Packages Using Process Modeling Techniques and Viscoelasticity Theory

Abstract: Panel Level Packaging (PLP) is an integrated circuit (IC) packaging technology that is mainly used in fields such as mobile communications, consumer electronics, and industrial automation.
Digi Times

ASE accelerates panel-level packaging push with fully automated 310mm line by 2026

AI and high-performance computing chip demand continue to expand, keeping TSMC's CoWoS capacity tight into 2026. The supply constraint is pushing Taiwan's major OSAT providers, including ASE Holdings, ...