10 years later, Curse of Strahd is still reshaping modern D&D

When Chris Perkins joins our video interview to talk about the 10th anniversary of Curse of Strahd on March 15, he’s holding ...
IEEE

A Highly Reliable 1.4μm Pitch Via-Last TSV Module for Wafer-to-Wafer Hybrid Bonded 3D-SOC Systems

Abstract: This paper demonstrates the fabrication of a reliable 0.7μm diameter and 5μm deep (0.7x5μm) via-last module, fitting a 1.4μm TSV pitch. Enabling sub-micron TSV diameters requires a thinner ...
IEEE

Low-Profile Four-Port MIMO Antenna Module Based 16-Port Closely-Spaced 2 × 2 Module Array for 6G Upper Mid-Band Mobile Devices

Abstract: The next six-generation (6G) mobile device is expected to support eight MIMO spatial streams to achieve a much larger spectral efficiency than the current fifth-generation (5G) 4×4 MIMO ...