Abstract: Solid–liquid interdiffusion (SLID) bonding finds a wide variety of potential applications toward die-attach, hermetic encapsulation of microelectromechanical systems (MEMS) devices and 3-D ...
Abstract: This work investigates the dynamic characteristics of vacuum arc in the initial expansion process of a direct current (dc) circuit breaker. Based on the commercial cup-type axial magnetic ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results