Abstract: High-bandwidth memory (HBM) placed side-by-side with ASIC on silicon interposer is capable of delivering the TB/s bandwidth. To maintain such high bandwidth, it is crucial to perform ...
Abstract: In this paper, the thermal performances of a Chiplet module designed with various configurations, such as monolithic die, 2.5D interposer, and 3D stacked dies, were studied and compared. The ...
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