Abstract: This paper presents a robust inspection framework for detecting non-wet defects in semiconductor solder joints using 3D CT slice imaging and supervised learning. The proposed method ...
Abstract: Multi-agent path finding (MAPF) problem in warehouse automation consists of optimal task assignment and path planning, where small runtime is necessary. In this letter, we present a new MAPF ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results